Innovent Technologies is the ultimate solution for all your End Effector (EE) needs

Our unparalleled expertise and technical knowledge in designing, fabricating, and manufacturing EE for the semiconductor industry set us apart from the competition.

Our EE solutions are specially tailored to handle silicon and glass substrates, which are critical components in the semiconductor manufacturing process. We offer aluminum vacuum and active edge grip EE with Teflon coating for increased corrosion resistance, ensuring that our products are durable and reliable in harsh environments.

We also provide stainless steel passive EE with no coating for operation in vacuum, which is ideal for applications that require a clean, contamination-free environment. In addition, we offer EE with O-ring platforms designed to fit suction cups for bowed wafer applications, providing a customized solution to meet specific requirements.

End Effectors

Learn even more about end effectors with our robust guide

Use our end effectors guide to learn more about their history, applications and the variety of features offered.

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Combining innovative designs with optimized materials, Innovent Technologies solves all of today’s substrate handling challenges.

Globally, in 2018, approximately 17 million wafers were processed.

There are 100’s of wafer processing steps that equates to many millions of substrate moves.
Innovent end-effectors moved >20% of them.
3D modeling optimizes all critical design parameters.
The best description of Innovent’s end-effectors: Limitless.

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Aluminum vacuum EE with Teflon coating for increased corrosion resistance. Pads are made to be coplanar within 0.0005″ (.013mm), to guarantee a wafer “pick” every time.

SST passive EE with DLC coating to create a uniform matte finish. This matte finish helps maximize the refraction of fiber-optic signals to aid in wafer presence applications. EE is straightened to within 0.002″ (0.05mm) flatness to prevent wafer/FOUP collisions.

SST passive EE with no coating for operation in vacuum. Dovetail channels are run up the tines as well as through the wrist for dual wafer presence/wafer mapping applications. Dovetails allow for easy encapsulation of fiber optic cables.

Aluminum vacuum EE with anodize finish. Built-in wrist minimizes the number of components and tolerance stack-ups. Built-in pads are lapped to a mirror finish to provide vacuum sealing ability and minimize wafer particle contaminants.

Aluminum wafer tray with no coating for operation in vacuum. Designed for 450MM wafers, this blade is flattened to within 0.005′ (0.13mm), to allow for consistent wafer “picks”.

Aluminum active edge grip EE with Teflon coating for increased corrosion resistance. Wrist and Support components are assembled and cycled in-house for a turn-key solution into EFEM.

Aluminum vacuum EE with anodize finish. O-ring platforms designed to fit suction cups for bowed wafer applications up to 0.080″ (2mm) of both convex and concave bowing.

At Innovent Technologies, we are committed to providing high-quality EE solutions that meet the most demanding requirements of the semiconductor industry.

With our technical expertise and unmatched capabilities, we are the only supplier you need to consider for all things End Effector. Contact us today to learn more about how we can help solve your design, fabrication, and manufacturing challenges.

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End Effectors for Advanced Wafer Processing & Wafer Handling