How does Innovent add value to the semiconductor chip manufacturing process?

IC Chip manufacturing equipment requires cutting-edge technology to keep up with the constant demand for higher performance and smaller features. Innovent continually invests in engineering, DFX, advanced equipment and process refinement enabling us to offer our clients cutting edge solutions to their most complex semiconductor equipment manufacturing challenges.

As die sizes continue to shrink, we understand the need to stay on top of market trends and customer requirements.

Innovent has extensive experience with manufacturing semiconductor equipment in numerous sectors of the chip manufacturing process, specifically, in the Front End, with Wafer Marking, Sorting, Etch/Depo, Implant, and inspection. Unique wafer handling solutions are implemented for the backend, incorporating automation and subsystem solutions in the litho, inspection, and deposition areas across multiple process steps.

At Innovent, we understand the critical importance of staying ahead in a rapidly evolving industry. That’s why we prioritize two key pillars: cleanliness and process controls. From meticulous testing, cleaning, and packaging meeting SEMI standards in ISO 5, 6, or 8 environments, to our dedicated Engineering Customer Reps overseeing every aspect, we ensure excellence at every step.

Our commitment goes beyond standards. With certifications like ISO 9001:2015, IPC620, and UL508A, backed by robust metrics tracking and supplier partnerships, we guarantee superior quality and on-time delivery. We dive deep into root cause analysis, providing detailed reports on quality failures and ensuring uninterrupted operations in our cleanrooms.

Join us at Innovent, where expertise meets innovation, and together we’ll shape the future of semiconductor manufacturing.

Read on to learn about the specific products Innovent manufactures and how those components and equipment are used in the semiconductor industry chip manufacturing process.

Here are a few steps needed to manufacture a semiconductor chip and how Innovent contributes and adds value to this process:

Design and Photomask Creation

Design of the chip begins with software like Cadence or Synopsys. Once the design is finalized, a photomask, a blueprint of the chip's circuits, is created.

Silicon Wafer Production

Pure silicon is formed into single crystal ingots, which are then sliced into thin discs called wafers. These wafers serve as the base for chip fabrication.

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Sorting

The process where a die is tested electrically while still in wafer form.

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Wafer Cleaning

Wafers are cleaned to remove any contaminants.

Oxidation

The wafer is heated in an oxygen-rich environment to grow an oxide layer, providing insulation between different layers of the chip.

Photolithography

The photomask is used to pattern the wafer with ultraviolet light, transferring the chip's design to the wafer.

Etching

The exposed areas of the silicon wafer are removed using various etching techniques.

Ion Implantation

Ions are implanted into the silicon wafer to change the properties of the silicon, making it either n-type or p-type silicon.

Metallization

Metal layers are added for interconnections between different components of the chip.

Chemical-Mechanical Polishing

The wafer is planarized to flatten the surface for further processing.

Inspection & Testing

At various stages throughout the process, the wafer and chips are inspected and tested for defects.

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Packaging

The completed chips are cut from the wafer and encapsulated in a protective package.

Final Test

The finished chip is tested to ensure it functions correctly.

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Semiconductor Chip Manufacturing Equipment

The manufacturing process of a semiconductor chip, also known as an Integrated Circuit (IC), is complex and requires several critical steps.

How does Innovent add value to the semiconductor chip manufacturing process?

Here are a few steps needed to manufacture a semiconductor chip and how Innovent contributes and adds value to this process:

Design and Photomask Creation

Silicon Wafer Production

Sorting

Wafer Cleaning

Oxidation

Photolithography

Etching

Ion Implantation

Metallization

Chemical-Mechanical Polishing

Inspection & Testing

Packaging

Final Test

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